ICROS™ TAPE

High-clean adhesive tape

Applications detail

Protective tape for formed circuit on wafer surface during the back grinding process of the semi-conductor manufacturing process

Applications

Characteristics

ICROS™ Tape has been the world top BG (Back grinding) tape for many decades. Now, our tape is not only used for BG process but also for many other processes in semiconductor manufacturing flow. Please refer to each tape explanation for more details.

icros1

 

Main features of ICROS™ Tape

icros2

 

icros3
  • Extremely low contaminated Tape (both UV and Non-UV)
  • Superior total thickness type
  • High adhesion and easy peel
  • High heat resistance & chemical resistant tape
  • Bump absorption of the wafer in the process
  • Custom made possible

Contact Us

MITSUI CHEMICALS INDIA, PVT. LTD.
TEL +91-96509 59960, +91-99588 14194
MAIL